Iyiphi indlela ye-PCBA?

1, SMT

Ukuphrinta okune-solder kuyisinyathelo sokuqala se-PCBA. I-solder paste ihlanganiswe kahle kwi-PCB pad ngokuphrinta kwesikrini. I-solder passe isetshenziswa njengendlela ephakathi nendawo yokuxhuma izikhonkwane kanye nama-pads ezinto ze-elekthronikhi ekushiseni okulandelayo, futhi ukunemba kwawo kokuphrinta kuthinta ikhwalithi ye-welding ye-mobile ye-mobilesity board izingxenye zamabhodi.

Ingxenye ekhuphuka futhi ikhombisa ukuthengisa:

Izakhi zentaba engaphezulu zibekwa ngokunembile kwi-PCB Pad, ezingacubungula izakhi ezahlukahlukene ngesivinini esikhulu nokunemba okuphezulu. I-Chip Capacitance kanye nokumelana kwe-computer boardboard kufakiwe kulokhu. Ngemuva kokuthi ibhodi yesekethe ebekiwe likhonjiswa, ukunamathisela okuthengiswayo kuncibilika futhi kuqinisa, ukuze izikhonkwane zezakhi namaphakethe zithengiswe ngokuqinile. Ukulawulwa kokushisa kuyadingeka ukuqinisekisa ikhwalithi nokuvimbela ukuthengisa okubonakalayo kanye nomjikelezo omfushane.

2, cwilisa

I-plug-in: Izakhi ezingenakufakwa yi-Surclytic Mount Technology (njengama-capacitor amakhulu we-electrolytic, ama-transformers, njll.), Faka izikhonkwane ezigodini ezihambisanayo zeBhodi yePCB ngesandla noma ngomshini we-plug-in.

I-Wave Soldering: Ibhodi le-PCB lifakwe kwingxenye edlula ngemishini yokuthengisa yegagasi, kanye noxhumana nabo be-PIN nge-Wave Peak eyakhiwe ngokuncibilikisa i-solder.

3. Ukutholwa kanye Nesigaba Sokuhlunga

Ukuhlolwa kokubukeka: Ngesandla noma ukusebenzisa okuzenzakalelayo kokuhlola okuhloliwe (AOI) Okokuhlola, hlola ukuthi isimo sokufaka sezakhi ebhodini lesekethe silungile, nokuthi ngabe kukhona ama-welding alungile, futhi noma ngabe kukhona amaphutha asobala afana nesifunda esifushane, avulekele umjikelezo futhi alahlekile izingxenye.

Ukuhlolwa kokusebenza kukagesi: Sebenzisa imishini yokuhlola engochwepheshe.